Molding Device MoldLine 205 BASIC

The device from Schäfer is suitable for the molding of hotmelt polyamides on technical components. This provides insulation and mechanical protection for specific assemblies, allowing them to withstand extreme conditions such as heat, dust, or moisture.

The MoldLine 205 BASIC consists of a control unit with a melting tank and a molding dispenser for the quick provision of molten hotmelt material. The molding device enables a wide range of applications — from free molding, known as “potting,” in housings to the precise filling of small tool molds.

Our high-quality hotmelt adhesives are ideal for technological applications and offer a variety of advantages. They provide rapid curing, enabling efficient production. Additionally, they are versatile and can be applied to various surfaces. Their strong adhesion ensures high durability, while their high temperature resistance guarantees reliable connections in demanding conditions.

The MoldLine 205 BASIC offers:
- Stepless temperature adjustment for flexible adaptation
- High-performance components for short heating times
- Temperature setting via LED display
- Molding pressure adjustment via manometer
- Compact design for easy handling

With the hotmelt molding device, Schäfer provides a cost-effective solution suitable for the production of prototypes as well as small batch sizes.